Samsung Electronics signed a strategic partnership with U.S. chip designer Broadcom valued at over $200 billion through 2030. The companies announced the collaboration at the AI Summit in San Francisco to build next-generation AI infrastructure.
The agreement covers High Bandwidth Memory supply and contract manufacturing using Samsung’s sub-2-nanometer process. Samsung will also provide advanced packaging solutions for Broadcom’s next-generation custom AI accelerators. This deal ensures a stable supply of high-performance chips for Broadcom through the end of the decade.
The memorandum of understanding secures long-term commitments to increase utilization at Samsung’s advanced manufacturing facilities. This partnership validates Samsung’s turnkey strategy of combining memory, foundry, and packaging services. The deal positions Samsung to compete more effectively in the expanding custom AI processor market.