BASF is exploring a 50:50 joint venture with Highsun Holding Group (HSCC) covering their European Polyamide 6 value-chain operations. The potential partnership aims to improve competitiveness and achieve cost efficiencies amid challenging conditions in the European chemical industry. The evaluation also includes the possible combination of their global extrusion activities outside North America.
Separately, BASF has signed a Letter of Intent with Taiwan’s Ministry of Economic Affairs to expand semiconductor materials production and innovation capabilities in Taiwan. The planned investment at BASF’s Kuanyin site is intended to support the manufacture of advanced chips below 2 nanometers, amid growing demand from AI and other high-performance computing applications.
BASF also presented its latest personal care innovations at in-cosmetics Asia 2026. In addition, it announced a collaboration with Tongji University on a used-pillow recycling initiative to explore circular economy concepts for polyurethane foam.