TSMC and GlobalFoundries have signed a five-year manufacturing agreement valued at $2 billion to establish a U.S.-based supply of silicon interposers. The components are used in TSMC’s advanced CoWoS (Chip-on-Wafer-on-Substrate) packaging technology, which is in high demand for artificial intelligence and high-performance computing systems.
GlobalFoundries will expand its facility in Malta, New York, to manufacture the interposers for TSMC. The facility will become the first U.S.-based source for this specific component, helping TSMC diversify its supply chain geographically. Volume production is expected to begin in the first half of 2028. The agreement provides a framework for future expansion based on customer demand.