AMD CEO Dr. Lisa Su visited Taiwan on October 6, 2026, for meetings with supply-chain partners, including TSMC. The reported purpose was to secure advanced manufacturing and packaging capacity for upcoming products, particularly AMD’s next-generation MI450 and MI455 AI server chips.
AMD expects the new products to ramp up in the second half of 2026 and into 2027. The visit comes amid strong demand for high-performance computing and AI chips.
Investors and analysts are watching TSMC’s ability to meet surging demand from the AI industry. Su’s meetings focused on ensuring AMD can scale CPU and GPU production to keep pace with the growing market.
No formal agreements were announced. The visit underscored the companies’ partnership and the importance of TSMC’s advanced process technologies to AMD’s production plans.