SK hynix broke ground on a $3.87 billion advanced packaging and R&D facility in West Lafayette, Indiana. The project marks the first advanced packaging plant for next-generation AI memory in the United States.
The facility strengthens the strategic semiconductor alliance between SK hynix, Nvidia, and TSMC. Federal and state governments are supporting the project with U.S. CHIPS Act subsidies and loans.
Mass production of next-generation High Bandwidth Memory is scheduled for the second half of 2028.