ASML and TSMC scale EUV masks to 12 inches, cutting manufacturing costs

ASML Holding N.V. and Taiwan Semiconductor Manufacturing Company (TSMC) launched a joint initiative to transition the industry to 12-inch Extreme Ultraviolet (EUV) lithography photomasks. This shift replaces the current six-inch standard.

The collaboration aims to increase manufacturing productivity and reduce costs for advanced nodes. The larger format also eliminates design stitching constraints.

Initial High-NA EUV systems will deploy using existing six-inch masks. The 12-inch format serves as a critical step for future semiconductor scaling.

TSMC expects to integrate ASML’s High-NA technology into high-volume manufacturing for advanced process nodes by 2030.