Samsung Electronics and ASML are expanding their partnership to advance semiconductor manufacturing for the AI era. The collaboration focuses on deploying ASML’s High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) lithography technology.
Samsung plans to become the first manufacturer to integrate High-NA EUV into high-volume DRAM production by 2028. This technology enables the production of smaller and more efficient memory chips.
Samsung is joining an industry initiative to transition from 6-inch to 12-inch photomask formats. This shift aims to increase productivity and reduce costs for future chip manufacturing.