Samsung Electronics and SK Hynix are competing to mass-produce CXL 3.2 AI memory this year. This technology interconnects CPUs, GPUs, and memory at high speeds. It enables efficient memory pooling to bypass the capacity limits of HBM and DDR DRAM.
Samsung plans to mass-produce its CXL Memory Module (CMM-D) 3.0 by the end of 2024. This module utilizes the latest CXL 3.2 specification to maximize performance. SK Hynix has also debuted its second-generation CXL 3.2 product.
These new modules roughly double the bandwidth of previous versions. Major technology firms including Nvidia and Microsoft expect to adopt the technology. The hardware aims to meet the explosive data processing demands of the AI era.