Xiaomi launched the Xring O3, its second-generation in-house system-on-a-chip (SoC). The processor uses TSMC’s 3-nanometer technology and will debut in a flagship foldable phone this September.
The move aims to reduce reliance on suppliers Qualcomm and MediaTek. By designing its own silicon, the world’s third-largest smartphone vendor joins Apple, Samsung, and Huawei in prioritizing hardware-software integration.
Initial shipment targets for the new chip are between 200,000 and 300,000 units. Xiaomi also announced two additional processors focused on artificial intelligence and autonomous driving.