Intel and Applied Materials are expanding their research and development partnership to accelerate technologies for future AI processors. The companies will align Applied Materials’ process technology with Intel’s advanced development fabs to speed up work on next-generation transistors, interconnects and advanced packaging, including Foveros.
The collaboration aims to shorten the time to market for semiconductor technologies needed to handle increasingly complex AI workloads. It comes amid intense industry demand for more powerful and efficient AI hardware.
By integrating equipment and manufacturing research more closely, the companies aim to address challenges in producing chips beyond the 14A node. The partnership also links Intel’s capital expenditures to the development of AI-focused platforms, an area of investor interest.