TSMC, Intel, and Samsung are adopting ASML’s High-NA extreme ultraviolet (EUV) lithography to meet rising AI chip demand.
TSMC will integrate this technology into high-volume manufacturing for advanced nodes starting in 2030.
TSMC and ASML launched a joint initiative to upgrade EUV photomasks from 6-inch to 12-inch standards.
This upgrade aims to increase factory productivity and lower chipmaking costs.
A pilot production line for the new photomasks is scheduled for 2031.
Full volume production is expected to begin by 2033.
TSMC’s stock price reached an intraday high on September 9 following the announcement.