TSMC reportedly plans to raise prices for advanced packaging by 10% to 20%. It also plans to raise prices for 2-nanometer and 3-nanometer wafers by 3% to 6%. TSMC expects the changes to take effect in early 2027.
High demand from the AI sector is driving the increases. TSMC’s leadership in Chip-on-Wafer-on-Substrate (CoWoS) technology gives it significant pricing power. CoWoS is critical for AI accelerators used by major technology companies such as NVIDIA and AMD.
TSMC maintained its 2026 capital expenditure guidance at an estimated $60 billion to $64 billion. The company is expanding its advanced packaging capacity to meet demand and aims to reach approximately 130,000 wafers per month by the end of 2026.