TSMC will integrate High-NA extreme ultraviolet (EUV) technology into high-volume manufacturing by 2030. This ASML-developed lithography prints finer circuit patterns for advanced chips. The technology enables more powerful and efficient processors for artificial intelligence applications.
TSMC and ASML launched an initiative to develop 12-inch photomasks. This upgrade doubles the size of the current 6-inch industry standard. The transition aims to increase factory productivity and reduce costs for future nodes.
The commitment aligns TSMC with competitors Intel and Samsung in adopting High-NA EUV. This move establishes a unified industry direction for next-generation semiconductor production.