TSMC is developing a new advanced packaging technology with Kinsus to meet rising AI chip demand. This technology functions similarly to Intel’s Embedded Multi-die Interconnect Bridge (EMIB). The strategic move provides an alternative to TSMC's constrained CoWoS capacity and aims to prevent customers from migrating to Intel.
Market reaction drove TSMC’s U.S.-listed ADRs up 7.64% on July 30. Taiwan-listed shares hit the 10% daily limit during the July 31 trading session. These gains reflect investor confidence in TSMC’s strategy to maintain leadership in the AI semiconductor market.