TSMC builds three advanced packaging plants, targeting $9.35 billion annual output

Taiwan Semiconductor Manufacturing Co. (TSMC) will construct three additional advanced packaging facilities in the Chiayi Science Park. The chipmaker broke ground on the park’s second phase to establish a dedicated industry cluster.

This expansion responds to surging global demand for high-performance computing (HPC) chips and CoWoS technology. Surging AI chip orders currently strain TSMC's capacity, causing some business to spill over to competitors.

The new facilities are part of a strategy to increase packaging capacity through 2026 and 2027. TSMC expects the Chiayi Science Park facilities to generate over NT$300 billion (US$9.35 billion) in annual output once fully operational.