TSMC confirmed it will integrate ASML’s next-generation High-NA extreme ultraviolet (EUV) technology into high-volume manufacturing by 2030. This technology enables finer circuit patterns to fit more transistors into smaller areas. The company aims to produce more powerful chips specifically for artificial intelligence applications.
TSMC and ASML also announced a joint initiative to upgrade EUV photomasks from the current 6-inch standard. They plan to transition to a larger 12-inch format. The partners target a pilot production line for these masks by 2031 to increase productivity.
Markets reacted positively to the announcement on September 9th. TSMC's stock reached an intraday high of NT$2,485 following the news.