Taiwan Semiconductor Manufacturing Co. (TSMC) says early production yields at its Phoenix, Arizona, facility are about four percentage points higher than those at comparable fabs in Taiwan. The result marks a milestone for the U.S. expansion, which has faced delays and cultural clashes, and signals progress in efforts to bring advanced chip manufacturing to the United States.
The Arizona fab began engineering wafer production in April using 4-nanometer technology. It remains on track to start volume production in early 2025.
The facility will make chips for clients including Apple and AMD. Its progress supports TSMC's plans to build two additional, more advanced fabs at the Arizona site.