Taiwan Semiconductor Manufacturing is reportedly considering raising prices for advanced chip-on-wafer-on-substrate (CoWoS) packaging by 10% to 20%, amid soaring demand. Demand is expanding beyond AI GPUs to server CPUs and custom ASICs, creating a supply-chain bottleneck.
Wedbush Securities analyst Matt Bryson said in a client note that, if the reports are accurate, the potential increase would signal TSMC’s pricing power and strong end-customer demand. He also said it could indicate that TSMC faces less competitive pressure from Intel’s packaging technology.
Other reports say TSMC has finalized plans to raise wafer prices by 3% to 6%, starting in January 2027.