During its Q3 earnings call, TSMC CEO C.C. Wei said the company was prepared to support customers facing supply constraints with Intel’s advanced packaging services. Although Wei did not name Intel, his comments clearly referred to Intel’s EMIB-T packaging technology, a crucial part of its foundry growth strategy.
The remarks underscore intensifying competition for advanced packaging of AI chips, a critical market bottleneck. After Wei’s comments, Intel shares fell nearly 6% amid a broad semiconductor selloff. TSMC’s positioning could make it harder for Intel to scale its new business and could affect future revenue and margins in the sector.