Cadence Design Systems expanded its partnership with Taiwan Semiconductor Manufacturing Company (TSMC). The collaboration accelerates the development of next-generation chips for artificial intelligence (AI) and high-performance computing (HPC).
Designers gain access to certified tools, advanced design flows, and silicon-proven intellectual property (IP). These resources support TSMC’s most advanced manufacturing processes.
The partnership includes tool certifications for TSMC’s A14 and N2P processes. It also introduces new IP specifically for the N3P and N2P nodes.
The collaboration enables complex 3D-IC and advanced packaging designs through TSMC's 3DFabric technology. This architecture supports wafer-scale systems capable of integrating hundreds of individual chiplets.