Samsung Electronics has partnered with Taiwan Semiconductor Manufacturing Co. (TSMC) to produce custom base dies for NVIDIA’s forthcoming high-bandwidth memory (HBM) chips, known as NVHBM. TSMC will use its advanced 3-nanometer process technology to manufacture the dies. This is the first time Samsung has partnered with TSMC on HBM manufacturing.
The partnership aligns Samsung with SK Hynix and Micron, which are also reportedly using TSMC’s process for NVIDIA’s next-generation memory. Samsung will continue to manufacture standard HBM and other custom products in-house.
Samsung is also considering using its own foundry capacity if demand for NVIDIA’s chips exceeds TSMC’s production capabilities. The arrangement aims to help meet rising demand for advanced memory in high-performance computing and AI.