Synopsys and TSMC expanded their partnership to accelerate development for next-generation AI and high-performance computing (HPC) systems. The collaboration delivers AI-powered electronic design automation (EDA) flows and multi-die design support for TSMC’s A14 and 2nm process technologies.
The joint effort provides certified EDA flows for the A14 process and agentic AI-assisted workflows to increase design productivity. Enhanced support for TSMC’s CoWoS® packaging technology will facilitate the creation of complex multi-die AI systems.
This initiative targets complex AI, data center, and automotive applications. The partnership also introduces expanded intellectual property (IP) for PCIe 7.0 and HBM4 to speed up the development of differentiated semiconductor products.