Samsung Electronics Executive Chairman Lee Jae-yong visited the company’s Advanced Package Lab in Yokohama, Japan, on November 1, 2026, the company’s 57th anniversary. He inspected technologies aimed at advancing packaging for next-generation AI chips.
Advanced packaging is becoming a critical bottleneck in AI hardware. Lee reviewed progress in packaging materials and process technologies and discussed collaboration with Japanese suppliers.
Samsung plans to invest about ¥40 billion in the research and development hub over five years. That is around $254 million.