NXP Semiconductors and Vanguard International Semiconductor (VIS), an affiliate of TSMC, have inaugurated their joint-venture 300mm wafer fabrication plant in Singapore. The facility cost US$7.8 billion and is operated by VisionPower Semiconductor Manufacturing Company (VSMC), their joint venture.
The fab has entered the risk production phase and is targeting mass production in the first quarter of 2027. It will make chips using 130nm to 40nm process technologies for the automotive, industrial, consumer, and mobile sectors.
The plant is expected to reach full capacity by 2029. At that point, it is expected to produce approximately 44,000 wafers per month and create about 1,600 jobs.
Strong customer demand has fully pre-sold the plant’s initial capacity. The companies are considering a second plant in Singapore.