nVent Electric PLC is partnering with Advanced Micro Devices (AMD) to provide rack-level cooling for the AMD Helios platform, designed for artificial intelligence workloads. The collaboration will integrate nVent’s rear door heat exchanger (RDHx) into the platform’s AI infrastructure.
The DC-powered cooling unit is designed for Helios’s double-wide rack. It captures heat not removed by direct-to-chip liquid cooling and returns cooled air to the surrounding data center, helping manage thermal loads in high-density AI computing environments.
nVent will showcase the cooling solution at the OCP Global Summit in San Jose, California, from October 12 to 16, 2026.