At its GTC conference in Berlin, NVIDIA announced plans to expand its global manufacturing capacity with key supply chain partners. The company plans to increase substrate capacity 2.5x over three years. It also plans to increase advanced packaging capacity by more than 300% with partner Amkor by the end of 2028.
NVIDIA introduced DSX POD, a reference design for modular AI data centers. The design can be deployed in as little as 14 days, compared with a typical six months.
CEO Jensen Huang said Europe needs to accelerate its adoption of AI. NVIDIA also highlighted numerous partnerships with European companies.
NVIDIA shares rose over 2% during the day. The initiatives are intended to meet demand for AI infrastructure and strengthen the company’s supply chain resilience.