Samsung Electronics will use rival TSMC’s 3-nanometer process to make base dies for Nvidia’s next-generation custom high-bandwidth memory, or NVHBM. The base dies require a standardized manufacturing process to ensure consistent performance.
Nvidia asked its main HBM suppliers—Samsung, SK Hynix and Micron—to use TSMC’s 3nm process for the base dies. This is the first time Samsung has outsourced a core part of its HBM manufacturing to its Taiwanese rival.
Samsung agreed to Nvidia’s request but will continue producing standard HBM in-house. It is also exploring using its own foundry for NVHBM if demand exceeds TSMC’s capacity.