NVIDIA has reached agreements with substrate suppliers IBIDEN, Samsung Electro-Mechanics, and Unimicron Technology Corporation to expand capacity for its AI infrastructure components. The partners aim to increase substrate capacity by 2.5 times over the next three years to meet demand for NVIDIA’s AI platforms.
The agreements are intended to strengthen and diversify NVIDIA’s global supply chain. CEO Jensen Huang described capacity constraints amid an unprecedented infrastructure buildout.
The partnerships also cover expanded advanced packaging with Amkor Technology and semiconductor testing with King Yuan Electronics (KYEC). NVIDIA is providing a $1.1 billion capacity reservation advance to support the construction of new U.S. facilities.