Intel shares rose 5.9% in pre-market trading following reports of a new partnership with Taiwanese display manufacturer AUO Optronics.
The collaboration focuses on developing Micro LED advanced packaging for co-packaged optics and high-density computing. This strategic move aims to challenge TSMC’s dominance in the AI chip packaging market.
The deal combines AUO’s glass processing and Micro LED manufacturing expertise with Intel’s recently patented technology for embedding semiconductor chips into glass substrates.
Recent positive analyst ratings and rumored memory chip manufacturing deals with SK Hynix further support Intel’s foundry ambitions. These developments bolster confidence in the company’s AI-driven turnaround strategy.