Intel is trading 7.3% up at $116.56 after reports it is collaborating with AUO Optronics on Micro LED advanced packaging for co-packaged optics and high-density computing.

  • The technology reportedly uses glass substrates, through-glass vias, and redistribution layers, strengthening Intel’s challenge to TSMC in AI packaging.
  • Broader risk-on sentiment, easing oil prices, and gains across semiconductor stocks are also supporting the move.