International Business Machines Corp. (IBM) today announced a research collaboration with Siemens to advance IBM’s nanostack architecture, a new three-dimensional transistor design. The companies will combine IBM’s semiconductor expertise with Siemens’ electronic design automation and process simulation capabilities to accelerate development of nanostack technology for manufacturing at scale.
The collaboration will develop design, simulation and lithography techniques for current and future generations of nanostack technology beyond the present 7 angstrom node. The companies aim to create advanced virtual models to optimize performance and address fabrication challenges before manufacturing begins.
The announcement comes as IBM prepares to release its third-quarter financial results on October 21.