Corning Incorporated, Lumentum, and Qualcomm Technologies announced a joint demonstration of a high-density die-to-die (D2D) optical interconnect. The technology supports AI scale-up architectures by providing high-bandwidth, low-power, and low-latency connectivity over extended distances. The companies will showcase the system at the ECOC 2026 conference in Málaga, Spain.
The collaboration integrates Corning’s multimode fiber connectivity with Lumentum’s VCSEL-based optical platform and Qualcomm’s D2D interface IP subsystem. This architecture targets future co-packaged and near-packaged optics essential for AI infrastructure. Corning shares rose 3% in premarket trading following the announcement.