🟢 Corning is trading 4.14% up in pre-market after announcing high-density optical die-to-die interconnect demonstration

Corning is trading 4.14% up at $156.35 after joining Qualcomm and Lumentum in announcing a high-density optical die-to-die interconnect demonstration for AI scale-up architectures.

• The demonstration combines Qualcomm’s interface technology, Lumentum’s VCSEL platform and Corning’s multimode-fiber connectivity, supporting higher bandwidth and lower power.
• Strong semiconductor and AI sentiment is adding support.
• Major U.S. indices and semiconductor shares are also higher pre-market.