Corning and Chinese display manufacturer BOE debuted a new through-glass via (TGV) glass core substrate at IPC 2026 in Beijing. The advanced substrate features a 15:1 aspect ratio designed for high-density interconnects.
Corning showcased a 515x510mm bare substrate panel specifically for the AI semiconductor and advanced packaging markets. BOE’s Chairman confirmed the company is preparing to invest in a mass production line for these glass substrate carriers.
This investment positions Corning as a primary technology supplier for BOE’s expansion into the semiconductor packaging sector.