Cisco and NVIDIA announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a high-density optical module technology for next-generation AI data centers. The collaboration aims to create a hardware ecosystem that lets AI builders scale performance and computing within the same network footprint while reducing the power allocated to networking.
Alongside its WebexOne 2026 event, Cisco also announced plans to open its Webex platform to AI agents and add native Google Meet support to RoomOS devices. Together, the initiatives reflect Cisco’s focus on integrating AI across its portfolio, from networking hardware to collaboration software, and its aim to serve as a key infrastructure provider for the AI era.