Applied Materials and Intel have expanded their R&D collaboration to develop next-generation chipmaking technologies for AI workloads. The work will focus on advanced transistors, interconnects and packaging, using Applied Materials’ EPIC Center in Silicon Valley and Intel’s research facilities. The partnership puts Applied Materials directly in the lab where future AI-focused production methods are being developed.
The collaboration extends a decades-long relationship and aims to shorten the time it takes to move advanced semiconductor technologies from the lab to high-volume manufacturing. The announcement comes as Applied Materials reports strong fiscal third-quarter revenue, underscoring the company’s growth trajectory amid the AI boom.