Applied Materials and Intel announced a collaboration to speed the development of manufacturing innovations for next-generation semiconductors used in AI computing. The companies will work at Applied Materials’ EPIC Center in Silicon Valley and Intel’s R&D campus in Oregon to shorten the time to market for advanced technologies.
Their work will focus on next-generation transistors, interconnects, and advanced packaging. Both companies cited rising demand for AI computing as a reason for deepening their partnership, which builds on a long history of working together on complex chip-scaling challenges.