ACM Research announced today that it received an order from a leading Chinese outsourced semiconductor assembly and test (OSAT) customer for its new 18-chamber Ultra C-wb tool. Designed for advanced wafer-level packaging, the tool supports production of 3D high-bandwidth memory (HBM), which is critical for artificial intelligence and high-performance computing.
The order adds to ACM Research’s activity in the advanced packaging sector, a high-growth area of the semiconductor industry. The company said the order reflects the competitiveness of its technology. The announcement drew a positive market reaction, with analysts noting the strategic importance of gaining share in the HBM packaging equipment market. The deal is expected to contribute to ACM Research’s revenue growth in the coming quarters.