SK hynix published a roadmap in the journal Nature Electronics for integrating Co-Packaged Optics (CPO) into AI and high-performance computing infrastructure. The company developed the strategy in collaboration with global researchers.
The plan replaces traditional copper wiring with light-based optical interconnects to increase data transmission speeds. This technology integrates optical transceivers directly into the same package as processors and High Bandwidth Memory (HBM).
An optics-centric architecture aims to solve data transfer bottlenecks and high power consumption issues. This transition supports the massive bandwidth requirements of next-generation data centers and AI accelerators.