SK Hynix is exploring Intel’s foundry services to manufacture base dies for upcoming HBM4E memory. This potential partnership aims to diversify a supply chain currently dependent on Taiwan Semiconductor Manufacturing Co. (TSMC). TSMC presently serves as the exclusive supplier for SK Hynix’s HBM4 base dies.
The base die functions as a critical logic chip at the bottom of the High Bandwidth Memory (HBM) stack. It manages the interface between the memory and processors such as GPUs.
SK Hynix seeks to secure production stability and gain leverage in price negotiations. Costs for base dies have increased significantly, prompting the search for manufacturing flexibility. While no final agreement is confirmed, the move indicates a strategic shift in the AI hardware market.