SK Hynix held a groundbreaking ceremony on August 27 for its new advanced chip packaging and R&D facility in West Lafayette, Indiana. This $4 billion project represents the company's first major investment in the U.S.
The facility will produce high-bandwidth memory (HBM) chips to power AI systems. Mass production is scheduled to begin in the second half of 2028.
The plant will create over 1,000 new jobs at the Purdue Research Park. U.S. federal incentives from the CHIPS and Science Act support the project.
SK Hynix will collaborate with Purdue University on research and development. This partnership aims to strengthen the domestic semiconductor ecosystem.